Survey on generalized safety and security technology for system on wafer

LI Peijie; GUO Wei; SHEN Jianliang; CAO Zhipeng; MEI Bo

doi:10.11959/j.issn.2096-109x.2025003

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Survey on generalized safety and security technology for system on wafer

Comprehensive Reviews | 更新时间：2025-03-20

- Survey on generalized safety and security technology for system on wafer
- Chinese Journal of Network and Information Security Vol. 11, Issue 1, Pages: 1-19(2025)
- 作者机构：
  
  信息工程大学，河南郑州 450001
- 作者简介：
- 基金信息：
  
  The National Key R&D Program of China(2022YFB4401401;2023YFB4404202)
- DOI：10.11959/j.issn.2096-109x.2025003
  CLC： TP309.2
- Received：29 June 2024，
  
  Revised：2024-11-24，
  
  Published：25 February 2025
- 稿件说明：
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李沛杰, 郭威, 沈剑良, 等. 晶上系统广义功能安全技术研究综述[J]. 网络与信息安全学报, 2025, 11(1): 1-19.

LI P J, GUO W, SHEN J L, et al. Survey on generalized safety and security technology for system on wafer[J]. Chinese Journal of Network and Information Security, 2025, 11(1): 1-19.
李沛杰, 郭威, 沈剑良, 等. 晶上系统广义功能安全技术研究综述[J]. 网络与信息安全学报, 2025, 11(1): 1-19. DOI： 10.11959/j.issn.2096-109x.2025003.

LI P J, GUO W, SHEN J L, et al. Survey on generalized safety and security technology for system on wafer[J]. Chinese Journal of Network and Information Security, 2025, 11(1): 1-19. DOI： 10.11959/j.issn.2096-109x.2025003.

摘要

随着集成电路摩尔定律的逐步失效，未来信息系统的技术物理形态将由集成芯片向集成系统发展，晶上系统作为集成系统的一种，相比2D/2.5D/3D集成芯片，既有传统SoC芯片的逻辑结构和2.5D/3D异构集成电路工艺集成的微系统结构，也有面向系统应用的软硬件协同结构，呈现出功能安全、信息安全和网络安全融合交织的系统级广义功能安全问题，现有2D/2.5D/3D IC芯片级的安全技术已难以满足。首先分析了2D/2.5D/3D IC的安全问题及从芯片上升到系统后现有芯片级安全技术的不足，然后阐述了晶上系统广义功能安全问题产生的过程、面临的新挑战和新机遇。首次将晶上系统与网络空间内生安全理论结合，提出一种晶上系统的广义功能安全威胁模型，给出晶上系统广义功能安全技术的3个发展趋势。

Abstract

With the failure of Moore's law in integrated circuits

the technical and physical form of information systems was expected to evolve from integrated chip (IC) to integrated system (IS). Compared to 2D/2.5D/3D IC

system on wafer (SoW)

as one of the IS

was characterized by both the logic structures of system on chip (SoC) and the microsystem structures for 2.5D/3D heterogeneous IC

as well as the macrosystem structures for complex applications. The existing 2D/2.5D/3D IC chip-level security technologies were found to be insufficient in addressing the proposed generalized safety and security (GSS) problems

which included functional safety

information security

and cyberspace security. Firstly

the security problems of 2D/2.5D/3D IC were analyzed

and the shortcomings of the existing security technologies were identified with the transition from IC to IS. Then

the causes of GSS problems and the associated challenges were analyzed. A GSS threat model for SoW was proposed for the first time by integrating the SoW with the cyberspace endogenous safety and security theory. Additionally

the research progress of GSS technology was summarized. Finally

three development trends of GSS technology for SoW were outlined.

关键词

Keywords

references

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